2011-06-13

Prototyping for 3D interconnect devices

The LDS method turns simple plastic components into complex interconnect devices, even directly on housing parts. The new LPKF Fusion3D 1000, the LPKF ProtoPaint LDS and a lab-compatible method for electroless metallization closes the gap between manufacturing and 3D design.

At SMT LPKF will for the first time be introducing a complete method for LDS prototypes, opening new doors: for new product designs, for additional functions and cost-effective advantages. Two of the developers have been nominated for the Young Engineer Award at SMT.

Come see for yourself at the SMT in Nuremberg from 5/03-5/05 in Hall 6/Booth 320.


Kontakta:
SOLECTRO AB
Gerhard Tetzlaff, 040-536614
www.solectro.se

Information about the company: Solectro AB

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