Find out more about LPKF systems for electronics production and prototyping at ELECTRONICA in Munich, November 11-14, 2014

The upcoming electronica show offers the next opportunities to find out more about new 
processes and systems for laser micro machining first hand.

You will find the range of LPKF systems for electronics production and prototyping at
Booth 419 in Hall A2.

Highlights are…

• The new MicroLine 2000 P laser system, which was especially designed for
  cutting of flex boards and cover layers.
  
  
• The systems for structuring of 3D molded interconnect devices (MID) also
  have an addition to the product family. The new LPKF Fusion 3D 1200 laser
   direct structuring system has a highly dynamic rotary indexing table that
  facilitates assembly and reduces non-productive time.
  
  
• In the stencil laser business LPKF is now expanding the working range. With
  little effort, the benchmark-setting StencilLaser G6080 can be extended to enable
  cutting of stencils with a length of 1600 mm (length of stencil frames: 1800 mm).
  These stencils simplify the manufacturing of LED lights, which can be used in place
  of conventional fluorescent tubes.

The proven prototyping lines will be on display at the booth with all top systems.
The ProtoLaser U3 for circuit board structuring and micro-processing of delicate
substrates, the ProtoMat D104, which combines mechanical, and laser processing,
and the LDS prototyping line will all show what they can do at Booth 419 in Hall A2
(Munich, November 11-14, 2014).

Our experts await your questions.
Find out first hand and arrange an appointment today.
You can also request a free admission ticket.